⚡ Master the art of precision reballing with effortless style!
The HT-90 BGA Reballing Station features a robust aluminum alloy construction designed for durability and oxidation resistance. It supports a wide range of BGA chip sizes from 9mm to 43mm with an adjustable knob and diversion groove for efficient solder ball placement and excess tin removal. Lightweight and universally compatible with laptop CPUs and mobile devices, it’s the essential tool for professional-grade manual BGA rework.
| Manufacturer | Walfront |
| Part number | Walfronthfrbemdv2w |
| Item Weight | 50 g |
| Manufacturer reference | Walfronthfrbemdv2w |
| Finish | Finish |
| Material | Material |
| Power source type | PowerSource |
| Installation Method | InstallationMethod |
| Item Package Quantity | 1 |
| Included components | inc |
| Batteries Included? | No |
| Batteries Required? | No |
