🧊 Lock in peak CPU performance with zero warp — because your rig deserves the best!
The Thermalright CPU Contact Frame is a precision CNC-machined retrofit buckle designed to prevent CPU warping on Intel 12th and 13th Gen LGA1700 motherboards. Featuring durable gold anodized sandblasted material and high thermal conductivity TF7 paste, it ensures stable, cool, and reliable CPU operation with easy installation included.
UPC | 796345713735 |
Model number | LGA1700-BCF-BLACK |
Item Weight | 9.07 g |
Product Dimensions | 7 x 5.3 x 0.6 cm; 9.07 g |
Item model number | LGA1700-BCF-BLACK |
Item Height | 0.6 Centimeters |
Item Width | 5.3 Centimeters |
Cooling type | forced convection |
Type of connector | 3-pin |
Wattage | 12.8 Watts |
Noise Level | 0.08 dB |
Compatible Device | Desktop |
Are batteries included? | No |
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